PC/ABS SABIC C2800
PC/ABS SABIC C2800
PC/ABS SABIC C2800 is a well‑balanced halogen‑free flame‑retardant alloy material. It combines the mechanical strength, heat resistance and UV‑resistance of polycarbonate (PC) with good moldability of ABS.
Main Applications
Electrical‑Electronic: thin‑wall products such as monitors, small‑home‑appliance housings, notebook computers, copiers, printers and other business‑equipment housings & internal parts; mobile‑phone housings, accessories and smart cards (SIM‑cards).
Automotive Industry: automotive interior and exterior parts such as instrument panels, pillar trims, instrument‑panel covers, grilles.
Home Appliances: internal and external parts for washing machines, hair dryers, microwave ovens.
Physical Properties
| Property Category | Test Item | Test Standard | Data | Unit |
|---|---|---|---|---|
| Physical Properties | Density / Specific Gravity | ASTM D792 | 1.17‑1.18 | g/cm³ |
| Melt Flow Rate (MFR) | 260°C/2.16 kg, ASTM D1238 | 16 | g/10 min | |
| Mold Shrinkage (Flow, 3.20 mm) | Internal Method | 0.40‑0.60 | % | |
| Water Absorption (24hr) | ASTM D570 | 0.10 | % | |
| Mechanical Properties | Tensile Strength (Yield) | ASTM D638 | 58.6‑59.0 | MPa |
| Elongation at Break | ASTM D638 | 50 | % | |
| Flexural Strength (Yield) | ASTM D790 | 96.5 | MPa | |
| Flexural Modulus | ASTM D790 | 2690 | MPa | |
| Izod Notched Impact Strength (23°C) | ASTM D256 | 427‑430 | J/m | |
| Rockwell Hardness (R‑Scale) | ASTM D785 | 120 | — | |
| Thermal Properties | Heat‑Distortion Temperature (1.8 MPa, unannealed) | ASTM D648 | 73‑80 | °C |
| Vicat Softening Temperature | ASTM D1525 | 90 | °C | |
| UL RTI (No Impact) | UL 746B | 60 | °C | |
| Electrical Properties | Volume Resistivity | ASTM D257 | 1.0E+17 | Ω·cm |
| Flame Retardancy | UL 94 Rating | UL 94 | V‑0 | — |
Processing Parameters
| Process Parameter | Unit | Recommended Value / Range |
|---|---|---|
| Drying Treatment | ||
| Drying Temperature | °C | 90‑110 |
| Drying Time | h | 2‑4 |
| Recommended Moisture Content | % | < 0.04 |
| Injection Molding Temperature | ||
| Melt Temperature | °C | 230‑300 |
| Mold Temperature | °C | 50‑100 |
| Injection Parameters | ||
| Injection Pressure | MPa | 80‑150 (depends on molded parts) |
| Injection Speed | — | As high as possible |
| Hold‑pressure | % of injection pressure | 40‑50 |
| Back Pressure | MPa | 5‑10 |
Note: All information above is for reference only!
